Senior Design Engineer with BE Degree 10+ Year’s hand-on
experience PCB design and Signal & Power Integrity.
2 years Experienced in Hardware design.
Experienced in Schematic entry and PCB Design tool set
(Cadence- Allegro, DX-Designer, ORCAD, Altium, Mentor
Xpedition).
Experienced in ANSYS SIWAVE, HFSS, ADS, HYPERLYNX.
Experienced in High-speed 100GHz interfaces 36x QSFP-DD-
100GbE with J2C+ Chip. (8371-Ball LGA Package)
Working Experience with Intel Soc Ice Lake HCC & LCC interface
with DDR4-DIMM 2SPC, HSIO, USB3.0 QSFP-DD 100G,
GDDR5, PCie Gen3, SATA Gen3.
Experienced in DDR4-2667, GDDR5, HSIO, JESD204, SATA
Gen3, PCIe Gen3, USB 3.0, DDR4-SODIMM, MIPI, QSPI.
Experienced in Telecommunication 5G network RRU-outdoor unit
- Band-N8, 5G power amplifier design.
Experienced in DFM, DFT, DFA using Valor tool set also
CAM350.
Experienced in Automotive design -EPS, ABS, ESS (Suspension),
ADAS (Radar), Battery Management system. Embedded coin
technology, Bus bar concept for high current, Copper Inlay PCB.
Experienced in RF design and Automotive design also Mill-
Grade design (DRDO).
Experienced in High-speed RF with Corner compensation &
Tapper Trace.